CEA-Leti’s 2016 Silicon Qubit Paves Way For Quobly’s QSOI

In 2016, researchers at CEA-Leti demonstrated a silicon spin qubit fabricated on a 300 mm wafer using standard industrial processes, a foundational step now bolstered by a strengthened collaboration with Quobly, the company says. The French quantum computing company, spun out from CEA-Leti and CNRS in 2022, will use the FAMES Pilot Line to refine new process flows for its QSOI architecture, which combines silicon spin qubits with FD-SOI technology and is being industrialized with STMicroelectronics. “Quobly was founded on more than 15 years of research at CEA-Leti and CNRS,” says Nicolas Daval, Quobly’s chief engineering officer, emphasizing the long-term partnership driving advances in scalable quantum processors.

2016 CEA-Leti Silicon Qubit Foundation for Quobly’s QSOI

This early achievement, using fully depleted silicon-on-insulator (FD-SOI) technology, established a critical precedent for scalable manufacturing, a key element Quobly now aims to realize. The 300 mm wafer size signaled an intention to move beyond laboratory prototypes toward production-compatible dimensions, a vision now being actively pursued.

Quobly is further solidifying its technological pathway through expanded access to the FAMES Pilot Line, a European initiative focused on advanced chip design and sustainable manufacturing. This access allows the company to test and refine new process flows and patterning techniques for future processor generations, complementing its existing industrial collaboration with STMicroelectronics.